Bergquist GapPad2000S40

FEATURES AND BENEFITS
• Thermal conductivity: 2.0 W/m-K
• Low “S-Class” thermal resistance at very
low pressures
• Highly conformable, low hardness
• Designed for low-stress applications
• Fiberglass reinforced for puncture,
shear and tear resistance

Gap Pad® 2000S40 is recommended for
low-stress applications that require a mid
to high thermally conductive interface
material.The highly conformable nature
of the material allows the pad to fll in air
voids and air gaps between PC boards
and heat sinks or metal chassis with
stepped topography, rough surfaces and
high stack-up tolerances.
Gap Pad® 2000S40 is offered with inherent
natural tack on both sides of the material
allowing for stick-in-place characteristics
during application assembly.The material
is supplied with protective liners on both
sides.The top side has reduced tack for
ease of handling.
TYPICAL APPLICATIONS INCLUDE
• Power electronics DC/DC; 1/4, 1/2, full bricks, etc.
• Mass storage devices
• Graphics card/processor/ASIC
• Wireline/wireless communications hardware
• Automotive engine/transmission controls
CONFIGURATIONS AVAILABLE
• Sheet form and die-cut parts